The FEI Helios Nanolab G3 DualBeam  FIB-SEM platform is designed to access a new world of extreme high resolution 2D and 3D characterization. Precise FIB slicing, combined with a high precision piezo stage and superb SEM performance support automated software for high-resolution sample surface montaging, unattended sample preparation, or 3D characterization. Serial slicing and imaging using the AutoSlice and View™ software creates a 3D-image stack with 4-nm isotropic resolution that may be reconstructed in separate software for high resolution visualization. Traditional SEM imaging allows high-resolution detail of sample surfaces of all types and materials to be quickly and easily elucidated.

Features

• Ideal for the analysis of surface topographies or post-fixed resin-embedded samples by secondary or backscatter electron detection using the ETD, retractable CBS, and in-column TLD, MD, or ICD detectors.
• The focused gallium-ion beam ablates fine slices as thin as 4-nm to reveal structure under the resin block surface in order to provide a novel 3D picture of the sample volume.
• Maps™ software package allows large-format montaging over hundreds of micrometers, providing a “Google Street View”-like dataset.
• Imaging data from any outside source may be imported and correlated in the Maps software for Correlative Light and Electron Microscopy (CLEM)
• A retractable STEM detector allows low-voltage (10-30 keV) screening of TEM specimens.

Fast Facts

• Isotropic 3D data acquisition
• High Efficiency detectors for SE and BSE imaging
• Precision 5-axes motorized stage
• Better than 1.0 nm SEM resolution at all keVs
• Better than 4.0 nm FIB resolution at 30 keV
• Low kV FIB imaging down to 500 V

Location

• Robertson Life Science Building P2

Visit the ThermoFisher website for more information on the Helios