FEI Helios Nanolab™ 650 DualBeam™ Microscope
• Isotropic 3D data acquisition
• High Efficiency detectors
• 3rd Generation Automation SW
• Cryo capability
• <0.8 nm SEM resolution
• <4.5 nm ion beam resolution (sample resolution is sample-dependent)
Helios Nanolab™ 650 DualBeam™ Technical Bulletin
About the Helios
The FEI Helios Nanolab™ 650 DualBeam™ platform is designed to access a new world of extreme high resolution 2D and 3D characterization, nanoprototyping, and higher quality sample preparation. Creating the most complex structures at the nanoscale is equally possible with extensive range of beam chemistries (gas injection), 16-bit pattern generator and integrated CAD, script or library-based patterning. Robust, precise FIB slicing, combined with a high precision piezo stage and superb SEM performance support automated software for unattended sample preparation or 3D characterization and analysis.
Location: Floor Zero, Richard Jones Hall
Ideal for the analysis of surface proteins and topographies.
The second beam, a focused ion beam, blasts off the surface of a sample (like a sandblaster) to reveal information just under the surface in order to provide a novel 3D picture of cell volume.
The scanning/blasting process known as "slice and view" takes approximately 16 to 24 hours.